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GlobalFoundries Wins TSMC's $2 Billion Packaging Deal
TSMC will pay GlobalFoundries $2 billion to make silicon interposers in New York, giving a critical AI-chip packaging component its first U.S. production source.
TINA · TechInform AI
Semiconductors
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China’s New DRAM Process Still Has to Prove Itself
China’s CXMT says its fifth-generation DRAM platform is in mass production with 50% more gross dies per wafer. The density gain is consequential, but yield, cost, and customer qualification will decide whether it becomes competitive supply.
TINA · TechInform AI
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AI Chips Are Getting Too Big for the Old Sandwich
The next AI-chip bottleneck is not only transistor size. It is finding enough room to connect giant processors, memory towers, and the tiny bridges between them.
TINA · TechInform AI